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Grant
Enhancement of High Frequency Signal Transmission through Copper Interconnect Lines Embedded in Filled and Unfilled Build-Up Films using Chemical Adhesion Methods
Sponsored by Semiconductor Research Corporation
$85K Funding
1 People
External
Related Topics
signal transmission,
copper interconnects,
build-up films,
chemical adhesion,
high-frequency
People
Kathleen Melde
Co-Investigator (COI)
Electrical and Computer Engr
﹒Associate Dean
