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Grant
High Density Broadband Signal Interconnects with Embedded Patterned Substrate Layers
Sponsored by National Science Foundation
$292.1K Funding
1 People
External
Related Topics
high density interconnects,
broadband signal,
embedded substrate layers,
patterned substrate,
signal interconnects
People
Kathleen Melde
Principal Investigator (PI)
Electrical and Computer Engr
﹒Associate Dean
